Build to Print fabrication of rigid, flex and rigid-flex printed circuit boards. 1 to 32 layers on FR4, Polyimide, BT Epoxy, Rogers, Kapton materials and a variety of substrates. Blind & Buried Vias. Quick-turn prototypes and small production runs. Bonded Heatsinks and Metal Core Boards. High Speed RF boards. Built for Aerospace, Defense, Military, Semiconductor Test, Medical, RF and Wireless Communications markets.

Also can provide circuit board designs and layout. Full turnkey contract electronic assemblies with parts and labor or consigned kits. We specialize in quick turns for R&D builds down to 48 hours.

High Mix - Low volume manufacturer.

Mil-Spec, MIL-PRF-55110 and AS9100 certified. ITAR registered.

IPC-6012, 6013, 6018 Class 1, 2 & 3 specifications.